Guest post provided by Denton Vacuum, LLC. Denton Vacuum manufactures machines that employ precision methods like Plasma-enhanced chemical vapor deposition for diamond-like film quality. Visit www.dentonvacuum.com for more information.
Plasma-enhanced chemical vapor deposition (PECVD) is a specific sputter disposition method, and a highly precise process that involves depositing thin films on a substrate. The film is unbelievably thin, anywhere from a few nanometers, to about 100 micrometers. It begins as a gas and through the process is eventually deposited in a solid state via a series of chemical reactions. The space between the reacting gasses is heated to such a high temperature, it is filled by plasma, the key state of matter that gives the coating such a hard and durable surface. Gas becomes plasma when a significant number of atoms and molecules are ionized. In this particular sputter deposition method, a radio frequency alternating current, or a direct current discharge between two electrodes creates the environment necessary to produce the film. Energetic electrons enable many processes that wouldn’t be possible at lower temperatures. The vaporized gas condenses on the surface of the target in the form of a diamond-like film.
Benefits of PECVD include an increased film deposition rate with this method, as opposed to thermal/electron-beam evaporation. Despite the trade off a lack of uniformity, the film quality is still maintained. This procedure is very useful in semiconductor manufacturing and other temperature sensitive material that would otherwise be limited in a high pressure environment. The practical application that industries can capitalize on comes in a number of different forms. This film has a diamond like carbon quality that can be used for a variety of applications such as photo thermal conversion of solar energy, DLC coatings on sulphide windows, and carbon coatings to the surface of aluminum mirrors.
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